you are here>  products> solder paste

product pages:

Solder paste

the flux medium is designed to leave minimal, non-tacky, transparent residue that does not need to be cleaned. The hydrophobic nature minimises the impact of humidity in the atmosphere on the chemistry.
   
 NEXUS   no - clean
 NX 9900i no-clean, pin testable, long tack and stencil life, closed system approved, easily cleanable residue, clear residue
 
 SNX 9911 no-clean, increased activity, long tack and stencil life, closed system approved, RO/M1, clear residue
   
 No - clean
 IF 9007' stencil printing, closed system approve, RE/L1
 
 IF 9009lt clear residue, increased solderability, RE/L1
   
 Lead free
 Delphine 5502  RE/L0, resists long soak profiles,100% halide- free, easily cleanable residue
 
 Delphine 5503 RE/L0, easily cleanable, resists long soak profiles,increased tack
   
 Water soluble
 WSP - IF 5002 good cleanability, high activity 

home   products   tech support   contact   company